Laser 3D Consistency Inspection System (ALM-360) is a high-precision height measurement equipment specially designed for the electronic processing industry. Principle overview: This 3D surveying and mapping system uses a block-shaped blue laser with ultra-small beam to irradiate the surface of the object to be measured. The equivalent thickness of the block-shaped blue laser block is only a few nanometers, and the imaging is performed by a dedicated blue laser imaging system. , There is a special photosensitive device for data collection. Thus, a detection data of a block-shaped reflective surface is finally obtained, which realizes non-contact, high-precision rapid automatic 3D mapping.

ALM-360 Laser 3D Consistency Tester

Description of equipment use:

Main application range: The equipment can measure the coplanarity, height, thickness, width, position offset and other items of materials such as SOP, QFP, BGA, CCGA and other devices before SMT production;

Features:

●The original imported Japanese Keyence laser head, the repeatability of height can reach 5μM.

Features:

1 This 3D surveying and mapping system uses blue laser as the light source, which is different from all other natural light, so its reflected light is not affected by the color of the workpiece surface and the surrounding environment.

2 This machine uses up to 64,000 shots per second, the highest shooting speed in the industry at present, avoiding various dynamic interference of the workpiece.

3 Reference plane slope automatic correction function.

●The purchase of linear motor + grating ruler for XY motion system can ensure the micron extreme precision repeatedly.

●The use of marble platform fully guarantees the plane accuracy of the test platform;

●Concise and convenient operation, easy to learn and use.

●Equipment production process parameters:

1. The equipment is equipped with a linear laser measurement mode.

2. The equipment supports measurement device package types including: BGA, SOP, QFP, CCGA, QFN, LCCC, PLCC, CSP, TSOPI, TSOPII and other devices

3. Equipment measurement accuracy: The height in the Z-axis direction is less than or equal to 5um, and the horizontal amount in the XY-axis direction is less than or equal to 10um.

4. Support full automatic calibration of X-axis, Y-axis and Z-axis, and equipped with calibration related tools and software;

5. Measurable device size: 0.1mm*0.1mm~50mm*50mm.

6. Measurable device height: 0.1mm~30mm.

7. Measurable device pin spacing: 0.1mm~50mm.

8. The software is intuitive and easy to operate, and has the function of saving and exporting test data. The data export supports Excel file format; the software has the function of data flatness analysis.

●Equipment production process parameters:

1. The equipment is equipped with a linear laser measurement mode.

2. The equipment supports measurement device package types including: BGA, SOP, QFP, CCGA, QFN, LCCC, PLCC, CSP, TSOPI, TSOPII and other devices

3. Equipment measurement accuracy: The height in the Z-axis direction is less than or equal to 5um, and the horizontal amount in the XY-axis direction is less than or equal to 10um.

4. Support full automatic calibration of X-axis, Y-axis and Z-axis, and equipped with calibration related tools and software;

5. Measurable device size: 0.1mm*0.1mm~50mm*50mm.

6. Measurable device height: 0.1mm~30mm.

7. Measurable device pin spacing: 0.1mm~50mm.

8. The software is intuitive and easy to operate, and has the function of saving and exporting test data. The data export supports Excel file format; the software has the function of data flatness analysis.